At a Glance
- Tasks: Lead innovative test-chip packaging projects and collaborate with teams to optimize performance.
- Company: Synopsys Inc, a leader in high-performance design technology.
- Benefits: Competitive salary, health benefits, and opportunities for professional growth.
- Other info: Join a dynamic team in Ottawa with excellent career advancement opportunities.
- Why this job: Make an impact in cutting-edge technology while leading exciting packaging initiatives.
- Qualifications: Experience in package design and strong communication skills required.
The predicted salary is between 109440 - 133760 $ per year.
Synopsys Inc in Ottawa is seeking a senior package design engineer to lead IP test-chip packaging initiatives.
You’ll drive 4–6 test-chip package designs annually from requirements through delivery, collaborating with internal teams, customers, and partners to optimize SI/PI performance.
You’ll apply 3D EM modeling with HFSS, define layer stacks, and guide customers through architecture evaluations, balancing electrical performance with manufacturability and cost.
English communication required.
#J-18808-Ljbffr
Senior Lead, High-Performance Package Design employer: Synopsys Inc
Join a forward-thinking company that values innovation and collaboration in the semiconductor industry. As an Innovative Project Engineering Manager, you'll thrive in a dynamic work culture that encourages professional growth and offers opportunities to lead groundbreaking Silicon IP projects. Located in a tech hub, our company provides competitive benefits and a supportive environment where your expertise will drive meaningful advancements in technology.
