Synopsys Inc in Ottawa is seeking a senior package design engineer to lead IP test-chip packaging initiatives. You’ll drive 4–6 test-chip package designs annually from requirements through delivery, collaborating with internal teams, customers, and partners to optimize SI/PI performance.
You’ll apply 3D EM modeling with HFSS, define layer stacks, and guide customers through architecture evaluations, balancing electrical performance with manufacturability and cost. English communication required.
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Senior Lead, High-Performance Package Design in Ottawa employer: Synopsys Inc
Join a forward-thinking company that values innovation and collaboration in the semiconductor industry. As an Innovative Project Engineering Manager, you'll thrive in a dynamic work culture that encourages professional growth and offers opportunities to lead groundbreaking Silicon IP projects. Located in a tech hub, our company provides competitive benefits and a supportive environment where your expertise will drive meaningful advancements in technology.
