Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools across innovative semiconductor connectivity solutions. Support interconnect technologies within an R&D hardware design team. This Package and PCB Layout Engineer contributes to the Signal Integrity Products business unit. The work includes feasibility assessments, multi-layer substrate layouts, and wafer-level interconnect designs. Collaboration spans signal integrity experts, manufacturing, thermo-mechanical engineering teams, and suppliers. Key Responsibilities:
Perform package design feasibility assessments for signal integrity experts Develop multi-layer substrate and carrier layouts Support 2D, 2.5D, and 3D IC configurations Develop wafer-level interconnect layouts using redistribution layers Coordinate designs with manufacturing and thermo-mechanical engineering teams Requirements:
Bachelor’s degree in engineering, physics, or relevant discipline Five years of high-speed package or advanced PCB layout experience Solid knowledge of high-speed layout and electronic design Advanced knowledge of EDA layout tools Understanding of RF, analog, and digital circuits Apply package layout, PCB expertise, and advanced EDA knowledge to high-speed designs at Semtech’s Signal Integrity Products business unit.
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Senior Package and PCB Layout Engineer in Calgary employer: Sierra Wireless
Semtech is an exceptional employer that fosters a collaborative and innovative work culture in Ottawa, where you can thrive as a Senior Digital Verification Engineer. With a strong emphasis on employee growth, you will have the opportunity to mentor junior engineers while working on cutting-edge projects in high-speed digital circuits and mixed-signal ICs. Enjoy competitive benefits and a supportive environment that encourages creative problem-solving and professional development.
