ASIC Physical Design Engineer: DSP Core Tapeout in Markham

ASIC Physical Design Engineer: DSP Core Tapeout in Markham

Markham Full-Time 69750 - 85250 $ / year (est.) On-site
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At a Glance

  • Tasks: Contribute to DSP core design for next-gen mobile and AI products.
  • Company: Join Qualcomm Canada, a leader in semiconductor technology.
  • Benefits: Gain hands-on experience with competitive pay and growth opportunities.
  • Other info: Perfect for early-career engineers passionate about tech.
  • Why this job: Dive into the complete ASIC development cycle and make an impact.
  • Qualifications: Strong foundation in VLSI and digital design fundamentals required.

The predicted salary is between 69750 - 85250 $ per year.

Qualcomm Canada ULC in Markham, Ontario is seeking a Physical Design Engineer to contribute to DSP cores used in next‑generation mobile, compute, and AI products. In this role, you will gain hands‑on exposure to the complete ASIC development cycle, from RTL handoff through physical implementation and tapeout.

This position is ideal for early‑career engineers with a strong foundation in VLSI and digital design fundamentals who are passionate about semiconductor technology and eager to build.

ASIC Physical Design Engineer: DSP Core Tapeout in Markham employer: Qualcomm

Qualcomm Canada ULC is an exceptional employer that fosters a collaborative and innovative work culture, making it an ideal place for Display Silicon System Debug Engineers to thrive. With a strong emphasis on employee growth, you will have access to mentorship opportunities and the chance to work alongside industry leaders in a cutting-edge environment. Located in Canada, the company offers competitive benefits and a commitment to work-life balance, ensuring that you can pursue meaningful and rewarding employment while contributing to groundbreaking technology.

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Contact Details:

Qualcomm Recruitment Team

We think you need these skills to ace ASIC Physical Design Engineer: DSP Core Tapeout in Markham

VLSI Design
Digital Design Fundamentals
ASIC Development Cycle
RTL Handoff
Physical Implementation
Tapeout Process
Semiconductor Technology