Embark on a transformative internship as a Digital Design Engineering Intern with Qualcomm in Toronto, Canada. Join a pioneering tech company and leverage your skills in hardware design to influence tomorrow's technology.
Qualcomm is seeking motivated Digital Design Engineering Interns for a 16-month program, beginning May/June 2027. This role focuses on high-speed interconnect solutions and requires skills in digital design, hardware languages, and analytical problem solving. Interns will gain hands-on experience and mentorship, working closely with a dynamic team to deliver real-world impact.
Key Responsibilities:
- Learn fundamentals of High-Speed Interconnect and SerDes Design
- Own the design implementation of new features
- Assess specifications and devise implementation plans
- Analyze design bugs through test failures
- Collaborate cross-functionally with various engineering teams
Requirements:
- Enrolled in Electrical/Computer Engineering or related field
- Knowledge of Verilog/System Verilog and Python
- Experience in digital logic and design methodologies
- Expected graduation date of November 2028 or later
- 1+ years of programming experience in C, C++, or Python
Contribute to innovative projects and enhance your engineering skills at Qualcomm, shaping the future of technology.
Digital Design Engineering Intern at Qualcomm in Toronto employer: QUALCOMM, Inc.
Qualcomm Canada ULC is an exceptional employer that fosters a dynamic work culture focused on innovation and collaboration in the field of AI and machine learning. Located in a vibrant tech hub, employees benefit from competitive compensation, a comprehensive benefits package, and ample opportunities for professional growth and development. Join a team that not only values your contributions but also supports your journey in shaping the future of connected devices.
