Elevate semiconductor packaging projects with onsemi as a Modeling and Simulation Engineer in Waterloo, Ontario. Utilize thermal-mechanical simulations to support innovative power module developments.
Join onsemi's Corporate R&D team as a Semiconductor Packaging Modeling and Simulation Engineer. This critical role demands expertise in thermal-mechanical simulation, problem analysis, and the Ag/Cu sintering process. You will analyze reliability issues, develop cutting-edge methodology, and collaborate on thermal modeling for safety and efficiency.
Key Responsibilities:
- Conduct thermal-mechanical simulations for microelectronic packaging
- Analyze reliability issues due to thermal problems
- Develop innovative simulation methodologies using AI and Digital Twin
- Maintain HW/SW environments for effective modeling
- Support team members on thermal modeling projects
Requirements:
- Master's or Ph.D. in Physics or Engineering
- 2-3+ years of experience in thermal and mechanical modeling
- Strong knowledge of CAD, Solidworks, and FEA software
- Familiarity with semiconductor packaging processes
- Excellent English communication skills
Harness your expertise in modeling and simulation to empower onsemi's commitment to energy-efficient innovations.
Modeling and Simulation Engineer at onsemi in Alton employer: onsemi
Join onsemi in Burlington, where innovation meets collaboration in a dynamic work environment. As a Product Engineer, you'll benefit from a culture that prioritizes employee growth and development, offering opportunities to enhance your skills while working on cutting-edge technology. With a commitment to sustainability and a focus on teamwork, onsemi provides a rewarding workplace that empowers you to make a meaningful impact in the field of electronics engineering.
