At a Glance
- Tasks: Lead the development of next-gen packaging solutions for silicon photonics and high-speed electronics.
- Company: Join Nokia, a leader in innovative technology and telecommunications.
- Benefits: Competitive salary, health benefits, and opportunities for professional growth.
- Other info: Dynamic work environment with a focus on innovation and collaboration.
- Why this job: Be at the forefront of technology, shaping the future of electronics.
- Qualifications: Experience in packaging development and strong teamwork skills.
The predicted salary is between 81000 - 99000 $ per year.
Nokia is seeking a Packaging Development Engineer to lead the development of next-generation packaging solutions for silicon photonics and high‑speed electronics.
You will own all advanced packaging activities—from flip chip to wirebonding—and oversee production readiness with cross‑functional teams.
Responsibilities include optimizing assembly, maintaining documentation and BOMs, and supporting contract manufacturers to ensure a smooth transition to mass production.
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Silicon Photonics Packaging Lead employer: Nokia
Nokia is an exceptional employer that fosters a culture of inclusion and respect, making it a great place for a D&O Technical Project Manager to thrive. With comprehensive benefits such as health and dental coverage, a corporate retirement savings plan, and opportunities for professional growth through tuition assistance, employees are supported both personally and professionally. Located in Canada, Nokia offers a dynamic work environment where innovative ideas are encouraged, and diverse teams collaborate to advance connectivity for a brighter world.
