Senior 6G RF Packaging Engineer for 2D/3D Integration in Ottawa

Senior 6G RF Packaging Engineer for 2D/3D Integration in Ottawa

Ottawa Full-Time 121500 - 148500 $ / year (est.) On-site
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At a Glance

  • Tasks: Advance wireless tech through RF/microwave packaging and 2D/3D integration in a hands-on lab.
  • Company: Join Huawei Canada, a leader in cutting-edge technology based in Ottawa.
  • Benefits: Competitive salary, innovative projects, and opportunities for patents and publications.
  • Other info: Dynamic environment with opportunities for cross-disciplinary research and career growth.
  • Why this job: Be at the forefront of wireless technology and collaborate with top experts in the field.
  • Qualifications: Experience in RF/microwave engineering and a passion for innovation.

The predicted salary is between 121500 - 148500 $ per year.

Huawei Canada in Ottawa seeks an Engineer to advance wireless technology in a cutting-edge lab.

The role emphasizes RF/microwave packaging, interposer design, and 2.5D/3D integration with hands-on lab work and test-vehicle development.

You will collaborate with RFIC, antenna, materials, and manufacturing teams, coordinate VNA and OTA measurements, and contribute to patents and publications while driving cross-disciplinary research in a dynamic environment.

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Senior 6G RF Packaging Engineer for 2D/3D Integration in Ottawa employer: Huawei Technologies Co.

At Huawei Canada, we pride ourselves on being an exceptional employer that fosters innovation and collaboration in the field of cloud serverless data systems. Our vibrant work culture encourages continuous learning and professional growth, providing employees with opportunities to lead groundbreaking research while engaging with global technologies. Located in a dynamic tech hub, we offer unique advantages such as access to cutting-edge resources and a supportive environment that values creativity and teamwork.

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Contact Details:

Huawei Technologies Co. Recruitment Team

We think you need these skills to ace Senior 6G RF Packaging Engineer for 2D/3D Integration in Ottawa

RF/Microwave Packaging
Interposer Design
2.5D/3D Integration
Hands-on Lab Work
Test-Vehicle Development
Collaboration with RFIC Teams
Antenna Design