Actalent in Ottawa is seeking a Microelectronics Packaging Design Engineer to lead the development of advanced microelectronic and packaging solutions across RF, optical, reliability, and process engineering disciplines. You will design and engineer packages, manage BOMs and documentation, mentor junior staff, and engage with customers while contributing to proposals and quotations for innovative packaging solutions.
#J-18808-Ljbffr
Senior Microelectronics Packaging Engineer - Kanata (Onsite) employer: Actalent
Actalent is an exceptional employer that fosters a collaborative and innovative work culture in Bedford, Nova Scotia. With a strong emphasis on employee growth, you will have the opportunity to mentor junior engineers while working on cutting-edge power electronics for defense systems. The hybrid workplace model and commitment to engineering excellence make Actalent a rewarding place to advance your career in PCB design.
